Applicable package type:

1.QFP, LQFP, TSOP, PLCC, SOT, SOD series;
2. Matrix SOP, SSOP, TSSOP series;
3. Chip tantalum, chip sensing and high requirements of DIP, TO, etc.;
4.DIP and SDIP series

Application:It is mainly used for the post-process packaging of integrated circuits and semiconductor devices.

Features:Multi-pots & multi-plungers. Implement short distance filling.

Advantages:Good plastic sealing technology, packaging quality improvement; The mold box adopts quick change structure, easy to use and maintenance.