Application:It is mainly used for the post-process packaging of integrated circuits and semiconductor devices.

Features:Multi-pots & multi-plungers. Implement short distance filling.

Advantages:Good plastic sealing technology, packaging quality improvement; The mold box adopts quick change structure, easy to use and maintenance.

Application: Suitable for TOWA, FICO, ASM, HANMI brand AUTO MOLD SYSTEM

It can cooperate with the automatic packaging system to use vacuum packaging to improve the internal quality of the product.

After packaging the mold, cut the reinforcement and bend the mold.